Point-of-use contamination control
Fabs of
the future.
Eliminating the need for cleanrooms in semiconductor manufacturing.
The problem
Every defect
has a cost.
Fabs already control particles, airflow, and microenvironment AMCs. But wafers still spend critical time waiting, moving, and staging between tools. At advanced nodes, parts-per-billion levels of airborne molecular contamination are enough to ruin them.
Corrosion. Hazing. Residue. Yield loss that conventional controls never see, because it happens in the gaps between process steps.
PID · Talos VOC destruction
Single run · 30 min
A single Talos run, measured live by onboard PID: VOC concentration falls to 7N UHP N2 purge in 16 minutes, and reaches levels below 1 ppb.
Talos · Modular purification system
Meet Talos.
Point-of-use contamination control, engineered as a modular system: a reactor that destroys airborne contamination wherever wafers sit exposed.
Destroys, doesn't collect
Contaminants are chemically destroyed at the source, not trapped in filters that saturate, get swapped, and get landfilled.
7N purity in 16 minutes
A single run takes VOC contamination from ambient down through 7N purity in 16 minutes. Measured, not modeled: the trace above is a real PID capture.
10 to 100X existing alternatives
Outperforms today's approaches, including UHP N2 purge, by one to two orders of magnitude.
Kills the second-largest opex line
Fabs spend enormously on ultra-high-purity nitrogen purge. Talos effectively eliminates that line item.
Live contamination monitoring
Onboard sensing reports contamination levels in real time, so clean is a number on a screen, not an assumption.
CleanPipe · Where Talos leads
CleanroomPipes.
Complete sealed transport for wafers between manufacturing steps, with modular adapters into every piece of semiconductor tooling. Tools, storage, and transit all become Talos-purified control volumes, so a wafer never touches outside air from first step to last. No cleanroom required.
Semiconductor manufacturing · anywhere
Today: piloting Talos inside semiconductor tooling. Tomorrow: outfitting entire fabs with CleanPipe.
The way forward
A pilot,
not a pitch.
We don't sell hardware off a slide. Every engagement starts small, measures honestly, and scales only when the numbers earn it.
Discussion
An initial conversation about your contamination sources, node constraints, and where you're seeing defects.
Evaluation
On-site assessment of your environment: constraints, layout, and the metrics that will define success.
Integration
Multi-system deployment across the facility, tuned to the environments that showed the most exposure.
The system in motion
The future of contamination control
in semiconductor manufacturing.
Facing yield problems?
We'll build a system to fix it.
We're piloting Talos inside semiconductor tooling, with CleanPipe fab integration on the roadmap. Pilot slots are limited, so tell us about your platform.